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DAFU attended the China Mobile Processing Industry Forum & Expo 2019

DAFU attended the China Mobile Processing Industry Forum & Expo 2019

2019-09-12


On 29th~ 31th August, DAFU new material co.,ltd attended the  China Mobile Processing Industry Forum & Expo ( Dongguan )2019 . During the industry forrum our engineer Mr. Qu Jianqiang had a speech about the 5G mobile phone back board material .

The PC/PMMA composite board is made by co-extrusion of PC and PMMA. It  has the high impact strength, bending resistance and good hardness and wear resistance. It improves the overall toughness of the PC materials. The board is transparent and high definition, high in gloss and strong in printability. After texture production, it can get a good streamer and bright glass effect. After hardening, the drop resistance is greatly improved, and there is no signal shielding, which can perfectly replace the glass for the back cover of the mobile phone and touch screen .

Widely used in the base film for various high pressure and hot pressing IMD/FIM molding processes, such as automotive control parts, interior parts, various instrument panels, optical instruments, etc. It can be made in mobile phone back cover, touch screen, etc. after hardening.















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